Product List

1. Precision Heat Spreaders & Cold Plates

 

Description:
CNC-machined aluminum and copper heat spreaders and passive cold plates designed for GPUs, power electronics, and dense electronic assemblies.

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Typical Applications:
• Compute enclosures
• Industrial electronics
• Defense and aerospace systems

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Capabilities:
• Custom geometries
• Tight flatness tolerances
• Low-cost, repeatable production

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2. Chip Carriers & Mechanical Substrates

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Description:
Mechanical carriers and mounting substrates used to support packaged ICs, modules, and electronics during assembly, test, and deployment.

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Typical Applications:
• Semiconductor packaging & test
• Hardware prototyping
• Low-volume ASIC programs

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Capabilities:
• Metal and hybrid substrates
• Assembly-ready formats
• Fast iteration cycles

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3. EMI / RFI Shielding Components

 

Description:
Shielding frames, covers, and grounding structures designed to meet electromagnetic compliance requirements.

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Typical Applications:
• Aerospace electronics
• Industrial IoT
• Automotive and defense subsystems

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Capabilities:
• Shielded housings
• Ground paths & interfaces
• Compliance-driven design

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4. Ruggedized Electronic Enclosures

 

Description:
Custom metal enclosures designed to protect electronics from thermal, mechanical, and electromagnetic stress.

 

Typical Applications:
• Edge compute
• Power systems
• Robotics & industrial automation

 

Capabilities:
• EMI-aware designs
• Thermal integration
• Small to mid-volume runs

 

 

5. Precision Fixtures & Test Hardware

 

Description:
Fixtures, jigs, and mechanical hardware used in electronics testing, calibration, and manufacturing.

 

Typical Applications:
• Contract manufacturers
• Test labs
• Semiconductor packaging lines

 

Capabilities:
• Repeatable builds
• Tight alignment tolerances
• Designed for production use

 

 

6. Power & Grounding Hardware

 

Description:
Mechanical power distribution and grounding components used in high-reliability electrical systems.

 

Typical Applications:
• Industrial power electronics
• EV subsystems
• Infrastructure equipment

 

Capabilities:
• Bus bars & ground plates
• Structural power components
• Cost-focused designs